Patent Assignment
Reel/Frame 038202/0159
Assignment of Assignor's Interest
Recorded: 2016-04-06
Pages: 6
Assignors
KIM, JU-YOUN
Executed: 2014-01-18
JANG, HYUNG-SOON
Executed: 2014-01-18
YOUN, JONG-MIL
Executed: 2014-01-18
HA, TAE-WON
Executed: 2014-01-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
High-Integration Semiconductor Device and Method for Fabricating the Same