IP Library Assignment 038216/0001
Patent Assignment
Reel/Frame 038216/0001

Assignment of Assignor's Interest

Recorded: 2016-04-07 Pages: 8
Assignors
LIU, CHI-CHUN
Executed: 2016-04-05
MAGBITANG, TEDDIE P.
Executed: 2016-04-04
SANDERS, DANIEL P.
Executed: 2016-04-06
SCHMIDT, KRISTIN
Executed: 2016-04-04
VORA, ANKIT
Executed: 2016-04-05
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
High-Chi Block Copolymers for Interconnect Structures by Directed Self-Assembly
Patent: 9,768,059 →
Application: 15/092,693 →
Publication: US 2017/0294341
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 4, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ELPIS TECHNOLOGIES INC.
Reel/Frame 052561/0161 →