Patent Assignment
Reel/Frame 038229/0020
Assignment of Assignor's Interest
Recorded: 2016-04-08
Pages: 4
Assignee
MITSUBISHI MATERIALS CORPORATION
3-2, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 1008117, JAPAN
Covered Property
(1)
Method of Manufacturing Power-Module Substrate with Heat-Sink