IP Library Assignment 038229/0332
Patent Assignment
Reel/Frame 038229/0332

Assignment of Assignor's Interest

Recorded: 2016-04-08 Pages: 3
Assignors
ZOHNI, WAEL
Executed: 2013-05-14
HABA, BELGACEM
Executed: 2013-05-14
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Multiple Die Stacking for Two or More Die
Patent: 9,640,515 →
Application: 15/094,087 →
Publication: US 2016/0225746
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →