Patent Assignment
Reel/Frame 038231/0701
Assignment of Assignor's Interest
Recorded: 2016-04-08
Pages: 6
Assignors
LEE, SEUNGYOUNG
Executed: 2016-02-22
BAEK, SANGHOON
Executed: 2016-02-22
DO, JUNG-HO
Executed: 2016-02-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Fabricating the Same