Patent Assignment
Reel/Frame 038232/0667
Assignment of Assignor's Interest
Recorded: 2016-04-08
Pages: 3
Assignors
NAKANO, MASAHIRO
Executed: 2003-01-09
GUNJI, KATSUHIKO
Executed: 2003-01-09
OIKAWA, YASUNOBU
Executed: 2003-01-09
SATO, KATSUO
Executed: 2003-01-09
Assignee
TDK CORPORATION
1-13-1, NIHONBASHI, CHUO-KU, TOKYO, 103-8272, JAPAN
Covered Property
(1)
Packaging Substrate and Manufacturing Method Thereof, Integrated Circuit Device and Manufacturing Method Thereof, and Saw Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.