Packaging substrate and manufacturing method thereof, integrated circuit device and manufacturing method thereof, and saw device
View Patent ↗A basic portion layer 21 of a substrate electrode 12 a connected to a projecting electrode 13 electrically and mechanically on a substrate member of ceramics. The substrate member on which the basic portion layer 21 is formed is subjected to sintering. A surface of the basic portion layer 21 in the sintered substrate member is polished. On the polished basic portion layer 21 , the plating layers 22, 23 are formed, so that surface roughness of the substrate electrode 12 a may be, for example, not larger than 0.1 μmRMS. Accordingly, junction strength of an integrated circuit element mounted on a packaging substrate by a flip-chip method can be improved.
1. An SAW device comprising:
an SAW element which has a piezo-electric substrate and at least one pair of resonators each of which has a shape of the teeth of a comb with being involved in each other;
a packaging substrate on which said SAW element is mounted through a plurality of bumps; and
a ratio between a total area of said a plurality of bumps formed on said SAW element and a mass of the SAW element being not smaller than 0.0085 mm 2 /mg.
2. An SAW device as claimed in claim 1 , wherein said a plurality of bumps are gold bumps.
3. An SAW device as claimed in claim 1 , wherein an electrode on which said a plurality of bumps are formed is composed of aluminum having a film thickness between 0.5 μm and 1.0 μm, both inclusive.
4. An SAW device as claimed in claim 1 , wherein said SAW device is a branching filter on which two said SAW elements having central frequencies of bands different from each other are mounted.