Patent Assignment
Reel/Frame 038262/0189
Assignment of Assignor's Interest
Recorded: 2016-03-25
Pages: 3
Assignors
MOON, JONG KYU
Executed: 2016-02-11
KIM, JONG WON
Executed: 2016-02-11
PARK, WAN CHOON
Executed: 2016-02-11
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Including Molded Stacked Die with Terrace-Like Edges