Patent Assignment
Reel/Frame 038282/0883
Assignment of Assignor's Interest
Recorded: 2016-03-29
Pages: 3
Assignor
HITACHI ULSI SYSTEMS CO., LTD
Executed: 2016-03-18
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME KOUTOU-KU, TOKYO, JAPAN
Covered Properties
(2)
A Method of Manufacturing a Semiconductor Device Including Dummy Regions and Dummy Wirings
Semiconductor Device and a Method of Manufacturing the Same and Designing the Same
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Patent Security Agreement
Jun 5, 2020
From: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 052853/0153 →
Release of Security Interest in Patents
Jul 8, 2020
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
Reel/Frame 053654/0254 →
Corrective Assignment to Correct the Assignor Name Previously Recorded on Reel 052853 Frame 0153. Assignor(S) Hereby Confirms the Patent Security Agreement.
Mar 2, 2021
From: ACACIA RESEARCH GROUP LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 056775/0066 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 053654 Frame: 0254. Assignor(S) Hereby Confirms the Assignment.
Jun 10, 2021
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC
Reel/Frame 057454/0045 →