IP Library › Assignment 038307/0941
Patent Assignment
Reel/Frame 038307/0941

Assignment of Assignor's Interest

Recorded: 2016-04-18 Pages: 2
Assignor
TAKANO, EIJI
Executed: 2016-03-09
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN
Covered Property (1)
Semiconductor Manufacturing Method and Laminated Body
Patent: 9,997,390 →
Application: 15/064,941 →
Publication: US 2016/0276201
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 29, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043052/0218 →
Merger Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
Change of Name and Address Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
Change of Name and Address Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →