Patent Assignment
Reel/Frame 038311/0521
Assignment of Assignor's Interest
Recorded: 2016-04-19
Pages: 4
Assignors
FURUTANI, TOSHIKI
Executed: 2016-03-25
SAKAI, SHUNSUKE
Executed: 2016-03-31
INAGAKI, YASUSHI
Executed: 2016-03-28
Assignee
IBIDEN CO., LTD.
2-1, KANDA-CHO, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Printed Wiring Board and Semiconductor Package