Patent Assignment
Reel/Frame 038332/0139
Assignment of Assignor's Interest
Recorded: 2016-04-20
Pages: 3
Assignee
JAPAN AVIATION ELECTRONICS INDUSTRY, LTD.
10-8, DOGENZAKA 1-CHOME, SHIBUYA-KU, TOKYO, 150-0043, JAPAN
Covered Property
(1)
Lead Bonding Structure