Patent Assignment
Reel/Frame 038337/0032
Assignment of Assignor's Interest
Recorded: 2016-04-20
Pages: 3
Assignor
TUNG, YU-CHENG
Executed: 2016-04-18
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Method for Fabricating Fin-Shaped Structure and Bump Made of Different Material