Patent Assignment
Reel/Frame 038337/0132
Assignment of Assignor's Interest
Recorded: 2016-04-21
Pages: 3
Assignee
BRIDGE SEMICONDUCTOR CORPORATION
3FL., 157 LI-TE ROAD, PEITOU DIST., TAIPEI, 11259, TAIWAN
Covered Property
(1)
Semiconductor Device with Face-to-Face Chips on Interposer and Method of Manufacturing the Same