Corrective Assignment to Correct the Co-Assignee Previously Recorded at Reel: 010359 Frame: 0928. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2016-04-04 Pages: 5

Assignors

MIYAKI, YOSHINORI

Executed: 1999-10-04

SUZUKI, HIROMICHI

Executed: 1999-10-04

SUZUKI, KAZUNARI

Executed: 1999-10-04

NISHITA, TAKAFUMI

Executed: 1999-10-04

ITO, FUJIO

Executed: 1999-10-04

TSUBOSAKI, KUNIHIRO

Executed: 1999-10-04

KAMEOKA, AKIHIKO

Executed: 1999-10-04

NISHI, KUNIHIKO

Executed: 1999-10-04

Assignees

HITACHI, LTD.

CHIYODA-KU, TOKYO, JAPAN

HITACHI ULSI SYSTEMS CO., LTD.

KODAIRA-SHI, TOKYO, JAPAN

Covered Properties (4)

Plastic molded type semiconductor device and fabrication process thereof

Patent: 6,291,273 →

Application: 09/331,721 →

Plastic Molded Type Semiconductor Device and Fabrication Process Thereof

Patent: 6,558,980 →

Application: 09/832,008 →

Publication: US 2001/0010949

Plastic Molded Type Semiconductor Device and Fabrication Process Thereof

Patent: 6,692,989 →

Application: 10/371,275 →

Publication: US 2003/0124770

Plastic Molded Type Semiconductor Device and Fabrication Process Thereof

Patent: 6,943,456 →

Application: 10/777,084 →

Publication: US 2004/0159922

Related Assignments (1)

Other recorded transfers of the patents in this record — the chain of ownership.