Patent Assignment
Reel/Frame 038241/0507
Assignment of Assignor's Interest
Recorded: 2016-03-24
Pages: 6
Assignor
HITACHI ULSI SYSTEMS CO., LTD.
Executed: 2016-03-18
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Properties
(69)
Semiconductor Integrated Circuit Device and Method for Making the Same
Patent:
5,904,556 →
Application:
08/584,065 →
Semiconductor Integrated Circuit Device and Control System
Patent:
5,736,948 →
Application:
08/592,974 →
An Emulator and Corresponding Trace Control Method
Patent:
6,055,651 →
Application:
08/763,318 →
Semiconductor Ic Device Having a Memory and a Logic Circuit Implemented with a Single Chip
Patent:
6,069,834 →
Application:
08/813,900 →
Sense Amplifier Circuit
Patent:
5,854,562 →
Application:
08/842,536 →
Semiconductor Integrated Circuit with Multiple Write Operation Modes
Patent:
6,091,640 →
Application:
08/941,676 →
Recognition Dictionary System Structure and Changeover Method of Speech Recognition System for Car Navigation
Patent:
6,112,174 →
Application:
08/970,109 →
Semiconductor Memory, Memory Device, and Memory Card
Patent:
6,016,560 →
Application:
08/981,094 →
A Phase Locked Loop Circuit and a Picture Reproducing Device
Patent:
5,982,239 →
Application:
09/011,225 →
Semiconductor Ic Device Having a Memory and a Logic Circuit Implemented with a Single Chip
Patent:
5,995,439 →
Application:
09/188,367 →
Sense Amplifier Circuit
Patent:
6,046,609 →
Application:
09/188,369 →
Method of Making Semiconductor Ingegrated Circuit Device Having Interconnection Structure with Aluminum Film Formed in Two Depositing Steps
Patent:
6,300,237 →
Application:
09/245,743 →
Plastic molded type semiconductor device and fabrication process thereof
Patent:
6,291,273 →
Application:
09/331,721 →
Semiconductor Device and Process for Producing the Same
Patent:
6,242,323 →
Application:
09/367,524 →
Semiconductor Integrated Circuit and Data Processing System
Patent:
6,134,148 →
Application:
09/378,505 →
Semiconductor Ic Device Having a Memory and a Logic Circuit Implemented with a Single Chip
Patent:
6,097,663 →
Application:
09/413,641 →
Semiconductor Memory, Memory Device, and Memory Card
Patent:
6,266,792 →
Application:
09/427,068 →
Semiconductor Device and Manufacturing Method Thereof
Semiconductor integrated circuit and data processing system
Patent:
6,163,485 →
Application:
09/522,441 →
Sense Amplifier Circuit
Patent:
6,271,687 →
Application:
09/531,530 →
Semiconductor ic device having a memory and a logic circuit implemented with a single chip
Patent:
6,246,629 →
Application:
09/551,878 →
Semiconductor integrated circuit and data processing system
Semiconductor device and manufacturing method thereof
Semiconductor device and manufacturing method thereof
Semiconductor Device and Manufacturing Method Thereof
Semiconductor device and manufacturing method thereof
Method of Manufacturing a Ball Grid Array Type Semiconductor Package
Semiconductor Device and Manufacturing Method Thereof
Semiconductor device and manufacturing method thereof
Semiconductor IC device having a memory and a logic circuit implemented with a single chip
Semiconductor Device
Plastic Molded Type Semiconductor Device and Fabrication Process Thereof
Process for Producing Semiconductor Device
Semiconductor Memory, Memory Device, and Memory Card
Semiconductor Device
Semiconductor Integrated Circuit and Data Processing System
Patent:
6,459,621 →
Application:
09/931,030 →
Semiconductor Integrated Circuit Device and Method for Making the Same
Semiconductor Non-Volatile Storage
Method of Fabricating Semiconductor Device
Semiconductor Ic Device Having a Memory and a Logic Circuit Implemented with a Single Chip
Semiconductor Integrated Circuit and Data Processing System
Semiconductor Integrated Circuit Device and Method for Making the Same
Semiconductor Integrated Circuit Device
Method of Manufacturing Semiconductor Device
Semiconductor Device and Manufacturing Method Thereof
Semiconductor Device and Manufacturing Method Thereof
Method of Manufacturing a Ball Grid Array Type Semiconductor Package
Method of Fabricating Semiconductor Device
Method of Manufacturing Semiconductor Device
Semiconductor Memory, Memory Device, and Memory Card
Semiconductor Device
Semiconductor Device and Method of Manufacturing the Same
Method of Fabricating Semiconductor Device
Plastic Molded Type Semiconductor Device and Fabrication Process Thereof
Semiconductor Device and Process for Producing the Same
Semiconductor Integrated Circuit Device and Method for the Same
Plastic Molded Type Semiconductor Device and Fabrication Process Thereof
Method of Fabricating Semiconductor Device
Semiconductor Device and Method of Manufacturing the Same
Method of Fabricating Semiconductor Device
Semiconductor Device and Process for Producing the Same
Semiconductor Device and Method of Manufacturing the Same
Method of Fabricating Semiconductor Device
Semiconductor Device and Method for Fabricating the Same
Method of Fabricating Semiconductor Device
Semiconductor Device and Method for Fabricating the Same
Semiconductor Device and Method for Fabricating the Same
Method of Fabricating Semiconductor Device
Semiconductor Device and Method for Fabricating the Same
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger and Change of Name
Aug 24, 2015
From: HITACHI ULSI ENGINEERING CORP.; HITACHI ULSI SYSTEMS CO., LTD.
To: HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 036401/0624 →
Assignment of Assignor's Interest
Aug 24, 2015
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 036400/0878 →
Change of Name
Aug 24, 2015
From: HITACHI MICROCOMPUTER ENGINEERING, LTD.; HITACHI MICROCOMPUTER SYSTEM, LTD.
To: HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 036433/0591 →
Change of Name
Mar 31, 2016
From: HITACHI MICROCOMPUTER SYSTEM, LTD.
To: HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 038871/0271 →
Merger
Mar 31, 2016
From: HITACHI ULSI ENGINEERING CORP.
To: HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 038157/0936 →
Corrective Assignment to Correct the Co-Assignee Previously Recorded at Reel: 010359 Frame: 0928. Assignor(S) Hereby Confirms the Assignment.
Apr 4, 2016
From: MIYAKI, YOSHINORI; SUZUKI, HIROMICHI; SUZUKI, KAZUNARI; NISHITA, TAKAFUMI
To: HITACHI, LTD.; HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 038338/0726 →
Corrective Assignment to Correct the Co Assignee Name Previously Recorded at Reel: 010440 Frame: 0746. Assignor(S) Hereby Confirms the Assignment.
Apr 4, 2016
From: SASAKI, HIROYUKI; AOTO, YOSHIKAZU; FUJITA, SHUYA; SUZUKI, TATSUYA
To: HITACHI, LTD.; HITACHI MICROCOMPUTER SYSTEM LTD.
Reel/Frame 038338/0722 →
Merger
Sep 1, 2016
From: HITACHI ULSI ENGINEERING CORP.
To: HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 039614/0669 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →