Patent Assignment
Reel/Frame 036433/0591
Change of Name
Recorded: 2015-08-24
Pages: 6
Assignors
HITACHI MICROCOMPUTER ENGINEERING, LTD.
Executed: 1990-10-01
HITACHI MICROCOMPUTER SYSTEM, LTD.
Executed: 1998-04-01
Assignee
HITACHI ULSI SYSTEMS CO., LTD.
22-1, JOSUIHON-CHO 5-CHOME, KODAIRA-SHI, TOKYO, JAPAN
Covered Properties
(11)
Semiconductor Device and Manufacturing Method Thereof
Semiconductor device and manufacturing method thereof
Semiconductor device and manufacturing method thereof
Semiconductor Device and Manufacturing Method Thereof
Semiconductor device and manufacturing method thereof
Method of Manufacturing a Ball Grid Array Type Semiconductor Package
Semiconductor Device and Manufacturing Method Thereof
Semiconductor device and manufacturing method thereof
Semiconductor Device and Manufacturing Method Thereof
Semiconductor Device and Manufacturing Method Thereof
Method of Manufacturing a Ball Grid Array Type Semiconductor Package
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 24, 2015
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 036400/0878 →
Merger and Change of Name
Aug 24, 2015
From: HITACHI ULSI ENGINEERING CORP.; HITACHI ULSI SYSTEMS CO., LTD.
To: HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 036401/0624 →
Assignment of Assignor's Interest
Mar 24, 2016
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 038241/0507 →
Merger
Mar 31, 2016
From: HITACHI ULSI ENGINEERING CORP.
To: HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 038157/0936 →
Change of Name
Mar 31, 2016
From: HITACHI MICROCOMPUTER SYSTEM, LTD.
To: HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 038871/0271 →