Patent Assignment
Reel/Frame 038157/0936
Merger
Recorded: 2016-03-31
Pages: 10
Assignor
HITACHI ULSI ENGINEERING CORP.
Executed: 1998-04-01
Assignee
HITACHI ULSI SYSTEMS CO., LTD.
22-1, JOSUIHON-CHO 5-CHOME, KODAIRA-SHI, TOKYO, JAPAN
Covered Properties
(28)
Semiconductor Integrated Circuit Device and Method for Making the Same
Patent:
5,904,556 →
Application:
08/584,065 →
Semiconductor Integrated Circuit Device and Control System
Patent:
5,736,948 →
Application:
08/592,974 →
Semiconductor Integrated Circuit with Multiple Write Operation Modes
Patent:
6,091,640 →
Application:
08/941,676 →
Semiconductor Memory, Memory Device, and Memory Card
Patent:
6,016,560 →
Application:
08/981,094 →
Method of Making Semiconductor Ingegrated Circuit Device Having Interconnection Structure with Aluminum Film Formed in Two Depositing Steps
Patent:
6,300,237 →
Application:
09/245,743 →
Semiconductor Integrated Circuit and Data Processing System
Patent:
6,134,148 →
Application:
09/378,505 →
Semiconductor Memory, Memory Device, and Memory Card
Patent:
6,266,792 →
Application:
09/427,068 →
Semiconductor Device and Manufacturing Method Thereof
Semiconductor integrated circuit and data processing system
Patent:
6,163,485 →
Application:
09/522,441 →
Sense Amplifier Circuit
Patent:
6,271,687 →
Application:
09/531,530 →
Semiconductor integrated circuit and data processing system
Semiconductor device and manufacturing method thereof
Semiconductor device and manufacturing method thereof
Semiconductor Device and Manufacturing Method Thereof
Semiconductor device and manufacturing method thereof
Method of Manufacturing a Ball Grid Array Type Semiconductor Package
Semiconductor Device and Manufacturing Method Thereof
Semiconductor device and manufacturing method thereof
Semiconductor Memory, Memory Device, and Memory Card
Semiconductor Integrated Circuit and Data Processing System
Patent:
6,459,621 →
Application:
09/931,030 →
Semiconductor Integrated Circuit Device and Method for Making the Same
Semiconductor Integrated Circuit and Data Processing System
Semiconductor Integrated Circuit Device and Method for Making the Same
Semiconductor Device and Manufacturing Method Thereof
Semiconductor Device and Manufacturing Method Thereof
Method of Manufacturing a Ball Grid Array Type Semiconductor Package
Semiconductor Memory, Memory Device, and Memory Card
Semiconductor Integrated Circuit Device and Method for the Same
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 24, 2015
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 036400/0878 →
Merger and Change of Name
Aug 24, 2015
From: HITACHI ULSI ENGINEERING CORP.; HITACHI ULSI SYSTEMS CO., LTD.
To: HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 036401/0624 →
Change of Name
Aug 24, 2015
From: HITACHI MICROCOMPUTER ENGINEERING, LTD.; HITACHI MICROCOMPUTER SYSTEM, LTD.
To: HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 036433/0591 →
Assignment of Assignor's Interest
Mar 24, 2016
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 038241/0507 →
Change of Name
Mar 31, 2016
From: HITACHI MICROCOMPUTER SYSTEM, LTD.
To: HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 038871/0271 →