Granted Patent
Utility
US 6,664,135 · App. 10/058,716
Method of manufacturing a ball grid array type semiconductor package
Inventors:
Chuichi Miyazaki, Yukiharu Akiyama, Masanori Shibamoto, Tomoaki Kudaishi, Ichiro Anjoh, Kunihiko Nishi, Asao Nishimura, Hideki Tanaka, Ryosuke Kimoto, Kunihiro Tsubosaki, Akio Hasebe
Patented Case
View Patent ↗
Granted: Dec 16, 2003
Filed: Jan 30, 2002
Inventors
Chuichi Miyazaki
Yukiharu Akiyama
Masanori Shibamoto
Tomoaki Kudaishi
Ichiro Anjoh
Kunihiko Nishi
Asao Nishimura
Hideki Tanaka
Ryosuke Kimoto
Kunihiro Tsubosaki
Akio Hasebe
Assignees (at issue)
Renesas Technology Corporation
Hitachi Ulsi Systems Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.