IP Library › Assignment 036401/0624
Patent Assignment
Reel/Frame 036401/0624

Merger and Change of Name

Recorded: 2015-08-24 Pages: 10
Assignors
HITACHI ULSI ENGINEERING CORP.
Executed: 1998-04-01
HITACHI ULSI SYSTEMS CO., LTD.
Executed: 1998-04-01
Assignee
HITACHI ULSI SYSTEMS CO., LTD.
22-1, JOSUIHON-CHO 5 CHOME, KODAIRA-SHI, TOKYO, JAPAN
Covered Properties (11)
Semiconductor Device and Manufacturing Method Thereof
Patent: 6,342,726 →
Application: 09/449,834 →
Publication: US 2001/0035575
Semiconductor device and manufacturing method thereof
Patent: 6,342,728 →
Application: 09/760,733 →
Publication: US 2001/0002064
Semiconductor device and manufacturing method thereof
Patent: 6,353,255 →
Application: 09/764,378 →
Publication: US 2001/0002069
Semiconductor Device and Manufacturing Method Thereof
Patent: 6,521,981 →
Application: 09/765,376 →
Publication: US 2001/0002730
Semiconductor device and manufacturing method thereof
Patent: 6,355,500 →
Application: 09/768,451 →
Publication: US 2001/0003048
Method of Manufacturing a Ball Grid Array Type Semiconductor Package
Patent: 6,365,439 →
Application: 09/770,494 →
Publication: US 2001/0003059
Semiconductor Device and Manufacturing Method Thereof
Patent: 6,472,727 →
Application: 09/771,648 →
Publication: US 2001/0005055
Semiconductor device and manufacturing method thereof
Patent: 6,355,975 →
Application: 09/771,670 →
Publication: US 2001/0004127
Semiconductor Device and Manufacturing Method Thereof
Patent: 6,670,215 →
Application: 10/058,319 →
Publication: US 2002/0064901
Semiconductor Device and Manufacturing Method Thereof
Patent: 6,642,083 →
Application: 10/058,711 →
Publication: US 2002/0066181
Method of Manufacturing a Ball Grid Array Type Semiconductor Package
Patent: 6,664,135 →
Application: 10/058,716 →
Publication: US 2002/0068380
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 24, 2015
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 036400/0878 →
Change of Name Aug 24, 2015
From: HITACHI MICROCOMPUTER ENGINEERING, LTD.; HITACHI MICROCOMPUTER SYSTEM, LTD.
To: HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 036433/0591 →
Assignment of Assignor's Interest Mar 24, 2016
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 038241/0507 →
Merger Mar 31, 2016
From: HITACHI ULSI ENGINEERING CORP.
To: HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 038157/0936 →
Change of Name Mar 31, 2016
From: HITACHI MICROCOMPUTER SYSTEM, LTD.
To: HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 038871/0271 →