Patent Assignment
Reel/Frame 038343/0117
Assignment of Assignor's Interest
Recorded: 2016-04-21
Pages: 6
Assignors
PARK, JONG LAE
Executed: 2015-11-23
LIM, SANG HO
Executed: 2015-11-23
LEE, HWANG SUB
Executed: 2015-11-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Application Processor and System on Chip