Patent Assignment
Reel/Frame 038414/0057
Assignment of Assignor's Interest
Recorded: 2016-04-28
Pages: 4
Assignors
PARK, JUNGRAE
Executed: 2016-03-09
LEI, WEI-SHENG
Executed: 2016-03-09
EATON, BRAD
Executed: 2016-03-09
PAPANU, JAMES S.
Executed: 2016-03-09
KUMAR, AJAY
Executed: 2016-03-10
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Hybrid Wafer Dicing Approach Using a Split Beam Laser Scribing Process and Plasma Etch Process