IP Library Assignment 038426/0327
Patent Assignment
Reel/Frame 038426/0327

Assignment of Assignor's Interest

Recorded: 2016-04-29 Pages: 3
Assignor
NEOBULB TECHNOLOGIES. INC.
Executed: 2016-03-31
Assignee
ENRAYTEK OPTOELECTRONICS CO.
NO 555 SOUTH XINYUAN ROAD, LINGANG, ROOM 211, FINANCIAL CENTER, SHANGHAI, CHINA
Covered Property (1)
Led Component by Integrating Epitaxial Structure and Package Substrate Together and Method of Manufacturing the Same
Patent: 8,916,888 →
Application: 13/871,793 →
Publication: US 2014/0306230
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 29, 2014
From: CHEN, JEN-SHYAN
To: NEOBULB TECHNOLOGIES, INC.
Reel/Frame 032784/0316 →
Assignment of Assignor's Interest Nov 28, 2016
From: ENRAYTEK OPTOELECTRONICS CO., LTD.
To: HONG KONG BEIDA JADE BIRD DISPLAY LIMITED
Reel/Frame 040434/0794 →
Assignment of Assignor's Interest Jan 27, 2021
From: HONG KONG BEIDA JADE BIRD DISPLAY LIMITED
To: JADE BIRD DISPLAY (SHANGHAI) LIMITED
Reel/Frame 055054/0588 →