Patent Assignment
Reel/Frame 040434/0794
Assignment of Assignor's Interest
Recorded: 2016-11-28
Pages: 8
Assignor
ENRAYTEK OPTOELECTRONICS CO., LTD.
Executed: 2016-09-26
Assignee
HONG KONG BEIDA JADE BIRD DISPLAY LIMITED
UNIT 7605, 76/F THE CENTER 99 QUEEN'S RD, CENTRAL, HONG KONG
Covered Properties
(4)
Light Source Assembly Having High-Performance Heat Dissipation Means
Led Component by Integrating Epitaxial Structure and Package Substrate Together and Method of Manufacturing the Same
Method of Manufacturing Led Component by Integrating Epitaxial Structure and Package Substrate Together
Led Component by Integrating Epitaxial Structure and Package Substrate Together and Method of Manufacturing the Same
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 30, 2005
From: CHEN, JEFFREY
To: NEOBULB TECHNOLOGIES, INC.
Reel/Frame 017080/0392 →
Assignment of Assignor's Interest
Apr 29, 2014
From: CHEN, JEN-SHYAN
To: NEOBULB TECHNOLOGIES, INC.
Reel/Frame 032784/0316 →
Assignment of Assignor's Interest
Nov 17, 2014
From: CHEN, JEN-SHYAN
To: NEOBULB TECHNOLOGIES, INC.
Reel/Frame 034257/0595 →
Assignment of Assignor's Interest
Apr 27, 2016
From: NEOBULB TECHNOLOGIES, INC.
To: ENRAYTECK OPTOELECTRONICS CO., LTD.
Reel/Frame 038389/0957 →
Assignment of Assignor's Interest
Apr 29, 2016
From: NEOBULB TECHNOLOGIES. INC.
To: ENRAYTEK OPTOELECTRONICS CO.
Reel/Frame 038426/0327 →
Assignment of Assignor's Interest
Apr 29, 2016
From: NEOBULB TECHNOLOGIES. INC.
To: ENRAYTEK OPTOELECTRONICS CO.
Reel/Frame 038426/0237 →
Assignment of Assignor's Interest
Apr 29, 2016
From: NEOBULB TECHNOLOGIES. INC.
To: ENRAYTEK OPTOELECTRONICS CO.
Reel/Frame 038426/0285 →
Assignment of Assignor's Interest
Jan 27, 2021
From: HONG KONG BEIDA JADE BIRD DISPLAY LIMITED
To: JADE BIRD DISPLAY (SHANGHAI) LIMITED
Reel/Frame 055054/0588 →