Method of manufacturing LED component by integrating epitaxial structure and package substrate together
View Patent ↗An integral LED component is mounted into a hollow carrier. The carrier has two conductive electrodes with opposite polarities. The LED component comprises a substrate, N number of LED epitaxial structures where N is a number greater than one, a third electrode and a fourth electrode. The N number of LED epitaxial structures are formed on the upper surface of the substrate, the at least one of the N number of LED epitaxial structures comprises a first and a second electrode. The third and fourth electrodes are formed on the upper surface and located outside the N number of LED epitaxial structures, the respective electrodes are electrically connected to form a circuit. The two conductive electrodes of the hollow carrier are used for electrically connecting the third and fourth electrodes of the substrate, and the lower surface of the substrate is exposed to the hollow carrier.
1. A method of manufacturing an integral LED component, comprising the following steps of:
forming an LED epitaxial structure layer on an epitaxial wafer substrate;
forming a light-reflective layer on the LED epitaxial structure layer and then forming a first bonding metal layer on the light-reflective layer;
forming a second bonding metal layer on a carrier wafer;
wafer bonding the first and the second bonding metal layer to form a third metal layer used as a first electrode of the LED epitaxial structure layer, so as to manufacture a composite wafer having the LED epitaxial structure layer;
removing the epitaxial wafer substrate from the composite wafer, so that the third metal layer, the light-reflective layer and the LED epitaxial structure layer can be formed on the carrier wafer;
forming M number of LED structure groups on the carrier wafer, wherein the M number of LED structure groups comprise N number of LED epitaxial structures, at least one third electrode and at least one fourth electrode, M and N are natural numbers greater than one, the at least one third and fourth electrode are located outside the N number of LED epitaxial structures and have opposite polarities;
forming at least one second electrode on the N number of LED epitaxial structures of the M number of LED structure groups;
coating a dielectric layer within a selected portion of the M number of LED structure groups;
manufacturing at least one conductor material layer on the dielectric layer for electrically connecting the at least one first electrode, the at least one second electrode, the at least one third electrode, and the at least one fourth electrode with each other, so as to form a circuit; and
cutting the M number of LED structure groups from the carrier wafer to separate the M LED structure groups into M number of integral LED components.
2. The method of manufacturing an integral LED component of claim 1 , further comprising the step of:
providing a solderable metal on the at least one third electrode and the at least one fourth electrode.
3. The method of manufacturing an integral LED component of claim 1 , further comprising the step of:
providing a phosphor material layer on the surface of the N number of LED epitaxial structures.
4. The method of manufacturing an integral LED component of claim 1 , further comprising the step of:
providing a transparent protective layer on the M number of integral LED components.
5. The method of manufacturing an integral LED component of claim 1 , further comprising the step of:
providing an optical lens above each N number of LED epitaxial structure.
6. The method of manufacturing an integral LED component of claim 1 , further comprising the step of:
embedding the integral LED component within a hollow area of a hollow carrier, wherein the hollow carrier has two conductive electrodes with opposite polarities used for connecting to an external power, and the two conductive electrodes of the hollow carrier are used for electrically connecting the at least one third electrode and the at least one fourth electrode, and the lower surface of the substrate of the integral LED component is exposed to the hollow carrier.