Patent Assignment
Reel/Frame 038426/0237
Assignment of Assignor's Interest
Recorded: 2016-04-29
Pages: 3
Assignor
NEOBULB TECHNOLOGIES. INC.
Executed: 2016-03-31
Assignee
ENRAYTEK OPTOELECTRONICS CO.
ROOM 211, FINANCIAL CENTER, NO. 555 SOUTH XINYUAN ROAD, LINGANG, SHANGHAI, CHINA
Covered Property
(1)
Led Component by Integrating Epitaxial Structure and Package Substrate Together and Method of Manufacturing the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 17, 2014
From: CHEN, JEN-SHYAN
To: NEOBULB TECHNOLOGIES, INC.
Reel/Frame 034257/0595 →
Assignment of Assignor's Interest
Nov 28, 2016
From: ENRAYTEK OPTOELECTRONICS CO., LTD.
To: HONG KONG BEIDA JADE BIRD DISPLAY LIMITED
Reel/Frame 040434/0794 →
Assignment of Assignor's Interest
Jan 27, 2021
From: HONG KONG BEIDA JADE BIRD DISPLAY LIMITED
To: JADE BIRD DISPLAY (SHANGHAI) LIMITED
Reel/Frame 055054/0588 →