LED component by integrating epitaxial structure and package substrate together and method of manufacturing the same
The present invention discloses an integral LED component which integrates LED epitaxial structure electrodes and interconnects with a package substrate together and an integral manufacturing process thereof. The integral LED component can be made with multiple epitaxial structures or with just a single epitaxial structure. The integral LED component can be mounted into a hollow carrier. And by having support by the hollow carrier, the package substrate can be mounted and contacted with a heat conductive or a dissipation device. The integral LED component is fabricated by wafer level process and cut from the wafer as an independent component. By different manufacturing process, the integral LED component can be made as Vertical LED structure or Lateral LED structure.
1. An integral LED component, mounted into a hollow area of a hollow carrier, the hollow carrier having two conductive electrodes with opposite polarities used for connecting to an external power, the integral LED component comprising:
a substrate, having an upper surface and a lower surface;
an LED epitaxial structure, formed on the upper surface of the substrate, the LED epitaxial structure comprising at least one first electrode and at least one second electrode, wherein the polarities of the at least one first electrode and the at least one second electrode are opposite; and
at least one third electrode and at least one fourth electrode, formed on the upper surface and located outside the LED epitaxial structure, the at least one third electrode and the at least one fourth electrode are electrically connected to the at least one first electrode and the at least one second electrode to form a circuit, wherein the polarities of the at least one third electrode and the at least one fourth electrode are opposite;
wherein the two conductive electrodes of the hollow carrier are used for electrically connecting the at least one third electrode and the at least one fourth electrode of the substrate, the lower surface of the substrate is exposed to the hollow carrier, and the substrate is supported by the hollow carrier so that the substrate can be flatly mounted and contacted with a heat conductive or a dissipation device.
2. The integral LED component of claim 1 , wherein the lower surface of the substrate can be contacted with the heat conductive or the dissipation device.
3. The integral LED component of claim 1 , wherein a lower surface of the hollow carrier is coplanar with the lower surface of the substrate.
4. The integral LED component of claim 1 , wherein the substrate is chosen from silicon, germanium, SiC, GaN, GaAs, sapphire or metal with dielectric layer.
5. The integral LED component of claim 1 , wherein the LED epitaxial structure is transferred from another epitaxial substrate onto the upper surface of the substrate.
6. The integral LED component of claim 1 , wherein the LED epitaxial structure is grown on the upper surface of the substrate directly by an epitaxial process.
7. The integral LED component of claim 1 , wherein the shape of the upper surface of the LED epitaxial structure can be hexagonal, circular, other geometric shapes or mixtures with various shapes.
8. The integral LED component of claim 1 , wherein there is an optical lens structure disposed above the LED epitaxial structure.
9. The integral LED component of claim 1 , wherein the at least one first electrode and the at least one third electrode are positive electrodes, and the at least one second electrode and the at least one fourth electrode are negative electrodes.
10. The integral LED component of claim 1 , wherein the at least one first electrode, the at least one second electrode, the at least one third electrode and the at least one fourth electrode are connected through a conductor material formed on a dielectric layer.
11. The integral LED component of claim 1 , wherein when the at least one third electrode and the at least one fourth electrode are connected with the external power, the upper surface and the lower surface of the substrate are in an electrically insulated state.
12. The integral LED component of claim 1 , wherein the integral LED component can be a DC-LED component or an AC-LED component.
13. The integral LED component of claim 1 , wherein the substrate further comprises an antistatic component, a control element, or a sensing element.