Patent Assignment
Reel/Frame 038432/0887
Assignment of Assignor's Interest
Recorded: 2016-05-02
Pages: 7
Assignors
YADDANAPUDI, VAMSI KRISHNA
Executed: 2016-04-26
ADHIYA, ANKIT R.
Executed: 2016-04-26
KULKARNI, ANIKET A.
Executed: 2016-04-26
NAGULAPALLY, MANOJ
Executed: 2016-04-26
Assignee
SAS IP, INC.
1019 E. LINCOLNWAY, CHEYENNE, WYOMING, 82001
Covered Property
(1)
Multi-Chip Module Package Compact Thermal Models
Application:
62/329,860 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.