IP Library › Patent Application 62329860
Patent Application Provisional
App. No. 62/329,860 · Confirmation No. 2091

Multi-Chip Module Package Compact Thermal Models

Applicant: SAS IP, Inc.
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2016-05-18 APP.FILE.REC Filing Receipt 3 View
2016-04-29 SPEC Specification 14 View
2016-04-29 CLM Claims 7 View
2016-04-29 ABST Abstract 1 View
2016-04-29 ADS Application Data Sheet 8 View
2016-04-29 DRW Drawings-only black and white line drawings 7 View
2016-04-29 WFEE Fee Worksheet (SB06) 2 View
2016-04-29 N417 Electronic Filing System Acknowledgment Receipt 3 View
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Quick Facts
App. No.
62/329,860
Filed
2016-04-29