Patent Assignment
Reel/Frame 038433/0088
Assignment of Assignor's Interest
Recorded: 2016-05-02
Pages: 6
Assignors
LEE, JEONG MIN
Executed: 2016-04-26
KWON, KEE HAE
Executed: 2016-04-26
PARK, JEONG EUN
Executed: 2016-04-26
HONG, CHANG MIN
Executed: 2016-04-26
CHUNG, JAE YOUP
Executed: 2016-04-26
Assignee
SAMSUNG SDI CO., LTD.
150-20 GONGSE-RO, GIHEUNG-GU, YONGIN-SI, 17084, KOREA, REPUBLIC OF
Covered Property
(1)
Thermoplastic Resin Composition with Excellent Heat Resistance and Molded Article Manufactured Using the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.