Patent Assignment
Reel/Frame 038439/0827
Assignment of Assignor's Interest
Recorded: 2016-05-02
Pages: 6
Assignors
HO, YEN-SHIH
Executed: 2016-04-25
CHANG, SHU-MING
Executed: 2016-04-25
LIU, TSANG-YU
Executed: 2016-04-25
HUANG, YU-LUNG
Executed: 2016-04-25
LIN, CHAO-YEN
Executed: 2016-04-25
SUEN, WEI-LUEN
Executed: 2016-04-25
CHEN, CHIEN-HUI
Executed: 2016-04-25
LIAO, CHI-CHANG
Executed: 2016-04-25
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK, JHONGLI DIST., TAOYUAN CITY, 32062, TAIWAN
Covered Property
(1)
Chip Package and Method for Forming the Same