Patent Assignment
Reel/Frame 038449/0426
Assignment of Assignor's Interest
Recorded: 2016-05-03
Pages: 3
Assignor
LU, WEN-LONG
Executed: 2016-03-28
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Method for Manufacturing the Same