Patent Assignment
Reel/Frame 038482/0806
Assignment of Assignor's Interest
Recorded: 2016-05-06
Pages: 6
Assignors
CHEN, YU-FENG
Executed: 2016-05-03
CHEN, CHIH-HUA
Executed: 2016-05-03
YU, CHEN-HUA
Executed: 2016-05-03
LIU, CHUNG-SHI
Executed: 2016-05-03
KUO, HUNG-JUI
Executed: 2016-05-03
TSAI, HUI-JUNG
Executed: 2016-05-03
TSAI, HAO-YI
Executed: 2016-05-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Process Thereof