Patent Assignment
Reel/Frame 038488/0600
Assignment of Assignor's Interest
Recorded: 2016-05-06
Pages: 4
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD RD., ARMONK, NEW YORK, 10504
Covered Property
(1)
Heterogeneous Integration Using Wafer-to-Wafer Stacking with Die Size Adjustment