Patent Assignment
Reel/Frame 038489/0319
Assignment of Assignor's Interest
Recorded: 2016-05-06
Pages: 3
Assignor
ULRICH, ROGER
Executed: 2016-04-18
Assignee
KANDOU LABS, S.A.
EPFL INNOVATION PARK, BUILDING I, LAUSANNE, 1015, SWITZERLAND
Covered Property
(1)
Multilevel Driver for High Speed Chip-to-Chip Communications