Patent Assignment
Reel/Frame 038489/0650
Assignment of Assignor's Interest
Recorded: 2016-05-06
Pages: 4
Assignors
SI, HONGBO
Executed: 2016-01-29
BANDARAPU, BHASKAR
Executed: 2016-01-29
GLEISSNER, ANDREAS
Executed: 2016-01-29
LOIDL, BERNHARD
Executed: 2016-02-01
Assignee
LAM RESEARCH AG
SEZ STRASSE 1, VILLACH, A-9500, AUSTRIA
Covered Property
(1)
Method and Apparatus for Processing Wafer-Shaped Articles