Patent Assignment
Reel/Frame 038502/0549
Assignment of Assignor's Interest
Recorded: 2016-04-22
Pages: 2
Assignor
WADA, SHOJI
Executed: 2016-03-22
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Bonding Stage and Method of Manufacturing the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.