Patent Assignment
Reel/Frame 038515/0328
Assignment of Assignor's Interest
Recorded: 2016-05-09
Pages: 9
Assignors
HSU, KAI-CHUN
Executed: 2016-04-26
WANG, CHING-CHUN
Executed: 2016-04-26
YAUNG, DUN-NIAN
Executed: 2016-04-26
LIN, JENG-SHYAN
Executed: 2016-04-26
TING, SHYH-FANN
Executed: 2016-04-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Pad Structure for Front Side Illuminated Image Sensor