Patent Assignment
Reel/Frame 038528/0464
Assignment of Assignor's Interest
Recorded: 2016-05-10
Pages: 4
Assignor
HENKEL CORPORATION
Executed: 2015-02-27
Assignee
HENKEL US IP LLC
ONE HENKEL WAY, ROCKY HILL, CONNECTICUT, 06067
Covered Property
(1)
Conductive Die Attach Film for Large Die Semiconductor Packages and Compositions Useful for the Preparation Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 10, 2016
From: ZHU, PUKUN; HOANG, GINA; GUPTA, SHASHI; LAIB, ANDREW
To: HENKEL CORPORATION
Reel/Frame 038528/0318 →
Assignment of Assignor's Interest
May 10, 2016
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 038528/0486 →
Assignment of Assignor's Interest
Mar 9, 2022
From: HENKEL IP & HOLDING GMBH
To: HENKEL AG & CO. KGAA
Reel/Frame 059357/0267 →