Patent Assignment
Reel/Frame 038528/0486
Assignment of Assignor's Interest
Recorded: 2016-05-10
Pages: 4
Assignor
HENKEL US IP LLC
Executed: 2015-02-27
Assignee
HENKEL IP & HOLDING GMBH
HENKELSTRASSE 67, DUESSELDORF, 40589, GERMANY
Covered Property
(1)
Conductive Die Attach Film for Large Die Semiconductor Packages and Compositions Useful for the Preparation Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 10, 2016
From: ZHU, PUKUN; HOANG, GINA; GUPTA, SHASHI; LAIB, ANDREW
To: HENKEL CORPORATION
Reel/Frame 038528/0318 →
Assignment of Assignor's Interest
May 10, 2016
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 038528/0464 →
Assignment of Assignor's Interest
Mar 9, 2022
From: HENKEL IP & HOLDING GMBH
To: HENKEL AG & CO. KGAA
Reel/Frame 059357/0267 →