Assignment of Assignor's Interest

Recorded: 2016-05-11 Pages: 3

Assignors

SHEN, HONG

Executed: 2016-05-10

WANG, LIANG

Executed: 2016-05-10

GAO, GUILIAN

Executed: 2016-05-10

Assignee

INVENSAS CORPORATION

3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134

Covered Property (1)

System and Method for Providing 3D Wafer Assembly with Known-Good-Dies

Application: 15/152,469 →

Publication: US 2017/0186730

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.