Patent Assignment
Reel/Frame 038569/0506
Assignment of Assignor's Interest
Recorded: 2016-05-12
Pages: 4
Assignors
LEE, CHI-JUNG
Executed: 2016-04-28
CHEN, HSIEN-WEI
Executed: 2016-04-28
SU, AN-JHIH
Executed: 2016-04-28
CHEN, WEI-YU
Executed: 2016-04-28
YANG, TIEN-CHUNG
Executed: 2016-05-02
HUANG, LI-HSIEN
Executed: 2016-04-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Multi-Stack Package-on-Package Structures