Patent Assignment
Reel/Frame 038580/0327
Assignment of Assignor's Interest
Recorded: 2016-05-13
Pages: 3
Assignors
LIU, WEN-HONG
Executed: 2016-03-30
LIN, HSUAN-YU
Executed: 2016-03-30
CHEN, HSIN-CHU
Executed: 2016-03-30
LAI, CHIH-MING
Executed: 2016-03-30
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING RD.,, CHUTUNG,, HSINCHU, 31040, TAIWAN
Covered Property
(1)
Electronic Device Package and Package Method Thereof
Patent:
9,614,187 →
Application:
15/084,463 →