Patent Assignment
Reel/Frame 038587/0025
Assignment of Assignor's Interest
Recorded: 2016-05-13
Pages: 3
Assignor
KOJIMA, HIRONARI
Executed: 2016-03-04
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Wiring Substrate, Manufacturing Method of Wiring Substrate and Electronic Component Device