IP Library › Assignment 038594/0329
Patent Assignment
Reel/Frame 038594/0329

Assignment of Assignor's Interest

Recorded: 2016-05-13 Pages: 6
Assignors
HYNECEK, JAROSLAV
Executed: 2016-04-02
KOROBOV, VLADIMIR
Executed: 2016-05-13
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Hybrid Bonded Image Sensor and Method of Operating Such Image Sensor
Patent: 9,991,306 →
Application: 15/154,739 →
Publication: US 2017/0170223
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Dec 23, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 041187/0295 →
Release of Security Interest in Patents Recorded at Reel 041187, Frame 0295 Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064151/0203 →