Patent Assignment
Reel/Frame 041187/0295
Security Interest
Recorded: 2016-12-23
Pages: 35
Assignor
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Executed: 2016-12-21
Assignee
DEUTSCHE BANK AG NEW YORK BRANCH
60 WALL STREET, NEW YORK, NEW YORK, 10005
Covered Properties
(242)
Semiconductor Devices and Methods of Making the Same
Method of Forming a Semiconductor Die
Application:
15/225,054 →
Publication:
US 2016/0343800
Single Wound Current Transformer Impedance Measurement Circuit
Ground Fault Circuit Interrupter and Method
Method for Regulating an Output Voltage Using a Converter Configured to Operate in a Critical Conduction Mode and a Frequency Fold-Back Mode and Structure
Electronic Device with Flexible Data and Power Interface
Electronic Device Including a Tunnel Structure
Semiconductor Die Singulation Method
Global Shutter Imaging Pixels
Semiconductor Die Singulation Method Using Varied Carrier Substrate Temperature
Electronic Die Singulation Method
Method of Forming a Balancing Circuit for a Plurality of Battery Cells
Wafer-Scale Marking Systems and Related Methods
Patent:
9,659,876 →
Application:
15/203,599 →
Electronic Device Including a Conductive Electrode
Method of Forming a Semiconductor Device Including Forming a Shield Conductor Overlying a Gate Conductor
Method of Forming a Semiconductor Device
Method for Manufacturing a Semiconductor Component Having a Common Mode Filter Monolithically Integrated with a Protection Device
Internal/External Clock Selection Circuit and Method of Operation
Patent:
9,614,509 →
Application:
15/181,076 →
Substrate Structures and Methods of Manufacture
Application:
15/206,612 →
Publication:
US 2016/0323997
Substrate Structures and Methods of Manufacture
Semiconductor Component Having Group Iii Nitride Semiconductor Device Mounted on Substrate and Interconnected to Lead Frame
Semiconductor Component and Method of Manufacture
Semiconductor Component and Method of Manufacture
Semiconductor Component and Method of Manufacture
Semiconductor Component and Method of Manufacture
Semiconductor Component and Method of Manufacture
Semiconductor Component and Method of Manufacture
Semiconductor Component and Method of Manufacture
Semiconductor Component and Method of Manufacture
Cascode Configured Semiconductor Component
HV MOS Leakage Compensation for Ultralow Current Operation
Cascode Configured Semiconductor Component and Method
Cascode Configured Semiconductor Component
Semiconductor Package with Elastic Coupler and Related Methods
Method for Insulating Singulated Electronic Die
Bidirectional Jfet and a Process of Forming the Same
Method of Forming a Semiconductor Device and Structure Therefor
Switched Mode Power Supply Converter
Method of Forming an Amplifier and Structure Therefor
Tunable Antenna for High-Efficiency, Wideband Frequency Coverage
Semiconductor Package for a Lateral Device and Related Methods
Semiconductor Package System and Related Methods
Method of Forming a Semiconductor Device and Structure Therefor
Patent:
9,755,032 →
Application:
15/188,240 →
Method of Forming a Semiconductor Device and Structure Therefor
Circuit Including Rectifying Elements and a Charge Storage Element and a Method of Using an Electronic Device Including a Circuit Having Switching Elements
Patent:
9,680,381 →
Application:
15/155,307 →
Circuit Including Dual Power Converters and an Inductor and a Method of Using an Electronic Device Including a Circuit Including Dual Power Converters and an Inductor
Semiconductor Component That Includes a Clamping Structure and Method of Manufacturing the Semiconductor Component
Process of Forming an Electronic Device
Over-Current Protection Circuit and Method for Voltage Regulators
High Density Semiconductor Package and Related Methods
Method of Forming a Semiconductor Device and Structure Therefor
Method of Forming a Semiconductor Device and Structure Therefor
Method of Forming a Semiconductor Device and Structure Therefor
Method of Reducing Residual Contamination in Singulated Semiconductor Die
Methods and Apparatus for Improved Bonding
Method of Forming an Igniter Circuit and Structure Therefor
Gallium Nitride Semiconductor Device with Isolated Fingers
Patent:
9,842,920 →
Application:
15/208,456 →
Guard Rings for Cascode Gallium Nitride Devices
Bond-Over-Active Circuity Gallium Nitride Devices
Process of Forming an Electronic Device Including a Bond Pad
Application:
15/175,191 →
Publication:
US 2017/0352582
Electronic Device Including a Polycrystalline Compound Semiconductor Layer and a Process of Forming the Same
Patent:
9,728,629 →
Application:
15/209,952 →
High Reliability Wafer Level Semiconductor Packaging
High Reliability Housing for a Semiconductor Package
Application:
15/175,226 →
Publication:
US 2017/0256576
Image Sensors with Led Flicker Mitigaton Global Shutter Pixles
Stacked-Gate Super-Junction Mosfet
Termination for a Stacked-Gate Super-Junction Mosfet
Patent:
9,620,585 →
Application:
15/205,247 →
Embedded Stacked Die Packages and Related Methods
Patent:
9,679,878 →
Application:
15/221,464 →
Feed-Forward Control System with Current Estimator
Half-Bridge Hemt Circuit and an Electronic Package Including the Circuit
Image Sensor Semiconductor Packages and Related Methods
Phase Delay Counting Analog-to-Digital Converter Circuitry
Bidirectional Hemt and an Electronic Package Including the Bidirectional Hemt
Thd Reduction in Off-Line Converters
Application:
15/161,422 →
Publication:
US 2017/0229957
Switched Mode Power Supply with Efficient Operation at Light Loads and Method Therefor
Capacitive Coupled Input Transfer Gates
Patent:
9,584,011 →
Application:
15/148,172 →
Semiconductor Package with Interposer
Application:
15/166,007 →
Publication:
US 2017/0345862
Led Current Balancing Circuit and Method Therefor
Pixels for High Performance Image Sensor
Pixels with Photodiodes Formed from Epitaxial Silicon
Electronic Device Including a Multiple Channel Hemt
Patent:
9,673,311 →
Application:
15/182,405 →
Methods for Clocking an Image Sensor
Method of Forming an Igniter Circuit and Structure Therefor
Patent:
9,525,273 →
Application:
15/136,230 →
Methods for Clocking an Image Sensor
Electrostatic Discharge Devices and Method of Making the Same
Charge Packet Signal Processing Using Pinned Photodiode Devices
Charge Packet Signal Processing Using Pinned Photodiode Devices
Charge Packet Signal Processing Using Pinned Photodiode Devices
Electronic Device Including a Multiple Channel Hemt and an Insulated Gate Electrode
Patent:
9,741,840 →
Application:
15/270,905 →
Adaptive Feedback Control System and Method for Voltage Regulators
Imaging Pixels with a Fully Depleted Charge Transfer Path
Stacked-Die Image Sensors with Shielding
Image Sensors with Color Filter Windows
Pixels with High Dynamic Range and a Global Shutter Scanning Mode
Semiconductor Device and Method of Manufacture
Method and Apparatus for a Low Power Voice Trigger Device
Logarithmic Pixels with Correlated Double Sampling
Semiconductor Copper Metallization Structure and Related Methods
Methods and Apparatus for an Imaging System
Semiconductor Device and Method of Forming an Alignment Structure in Backside of a Semiconductor Die
Application:
15/218,717 →
Publication:
US 2017/0084545
Semiconductor Device and Method of Forming a Curved Image Sensor
Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding
Process of Forming an Electronic Device Including Forming an Electronic Component and Removing a Portion of a Substrate
Electronic Device Including a Bidirectional Hemt
Semiconductor Device Having Self-Isolating Bulk Substrate and Method Therefor
An Electronic Device Including a Transistor and a Field Electrode
Image Sensor with Glow Suppression Output Circuitry
Methods of Forming Imaging Pixel Microlenses
Process of Forming an Eletronic Device Including a Ball Bond
Led Lighting System
High Dynamic Range Imaging Pixels with Improved Readout
High Dynamic Range Imaging Pixels with Improved Readout
Dual-Photodiode Image Pixel
Imaging Pixels Having Coupled Gate Structure
Power Conversion Efficiency Using Variable Switching Frequency
Active Output Driver Supply Compensation for Noise Reduction
System and Method for Single Radio Multi-Device Communication
System and Method for Device Charging
Quad Flat No Leads Package with Locking Feature
Packaged Semiconductor Devices with Multi-Use Input Contacts and Related Methods
Polymer Resin and Compression Mold Chip Scale Package
Image Pixels Having Processed Signal Storage Capabilities
Wheatstone Bridge Sensing System with Multiple Current Sources
Through-Substrate via Structure and Method of Manufacture
Method for Removing Material from a Substrate Using in-Situ Thickness Measurement
Semiconductor Device and Method of Forming Cantilevered Protrusion on a Semiconductor Die
Stacked Semiconductor Device Structure and Method
Semiconductor Device and Method of Forming Micro Interconnect Structures
Method of Manufacturing a Semiconductor Device Having Reduced on-State Resistance and Structure
Low-Power Conversion Between Analog and Digital Signals Using Adjustable Feedback Filter
Synchronous Switching Circuit
Distributed Phase Locked Loop in Hearing Instruments
Holes and Dimples to Control Solder Flow
Carrier Tape with Standoff Units
Rotor Position Sensing System for Three Phase Motors and Related Methods
Patent:
9,831,808 →
Application:
15/219,021 →
Rotor Position Sensing System for Three Phase Motors and Related Methods
Patent:
9,831,809 →
Application:
15/215,425 →
Methods and Devices for Increasing the Spectral Response of an Image Sensor
Methods and Apparatus for an Image Sensor with a Multi-Branch Transistor
Patent:
9,871,068 →
Application:
15/242,326 →
Methods and Apparatus for a Multiple Storage Pixel Imaging System
Die Support for Enlarging Die Size
Patent:
9,748,163 →
Application:
15/230,749 →
Temporary Energy Storage for Voltage Supply Interruptions
Application:
15/174,758 →
Publication:
US 2017/0271975
Image Sensor Pixels Having Separated Charge Storage Regions
Methods and Apparatus for a Readout Circuit
Methods and Apparatus for Reducing Spatial Flicker Artifacts
Pixel and Circuit Design for Image Sensors with Hole-Based Photodiodes
Image Sensors Having High Dynamic Range Functionalities
Current Sense Detection for Synchronous Rectification
Piezo Transducer Controller and Method Having Adaptively-Tuned Linear Damping
Single Reflow Power Pin Connections
Circuit with Transistors Having Coupled Gates
Circuit for Acoustic Distance Measuring
Process of Forming an Electronic Device Including Exposing a Substrate to an Oxidizing Ambient
Application:
62/402,440 →
Image Sensor Chip Scale Packages and Related Methods
Patent:
9,691,811 →
Application:
15/171,966 →
Imaging Sensor Having Floating Region of Imaging Device on One Substrate Electrically Coupled to Another Floating Region Formed on a Second Substrate
Ring Oscillator with Opposed Voltage Ramps and Latch State
Image Sensors Having High-Efficiency Charge Storage Capabilities
Semiconductor Device Having Improved Superjunction Trench Structure and Method of Manufacture
Patent:
9,768,247 →
Application:
15/148,170 →
Image Sensors Having High Dynamic Range Functionalities
Application:
15/184,458 →
Publication:
US 2017/0366766
Chip Scale Package and Related Methods
Patent:
9,754,983 →
Application:
15/210,716 →
Embedded Image Sensor Semiconductor Packages and Related Methods
Methods and Apparatus for a Light Sensor
Dynamic Charging Without Constant Voltage Stage to Extend Battery Life
Temperature Compensated Constant Current System and Method
METHODS AND APPARATUS FOR A DELTA SIGMA ADC with Paralled-connected Integrators
Patent:
9,641,192 →
Application:
15/181,942 →
Auto-Tuning Current Limiter
Systems and Methods for Audio Playback
Method and Apparatus for Synchronous Rectifier
Patent:
9,837,916 →
Application:
15/203,533 →
Spread Spectrum Clock Generator and Method
Bi-Directional Feedback Pin
Image Sensors with a Rolling Shutter Scanning Mode and High Dynamic Range
Bandgap Reference Circuit and Method Therefor
Patent:
9,727,074 →
Application:
15/180,381 →
Electronic Device Including a Conductive Structure Surrounded by an Insulating Structure
Electronic Device Including an Insulating Structure
Efficient Closed Loop Tuning Using Signal Strength
Methods and Apparatus for Error Detection in an Imaging System
Integrator-Based Circuit Compensation
Application:
62/401,391 →
Circuit for Generating a Reference Current Proportional to Square of Clock Frequency
Patent:
9,692,440 →
Application:
15/160,250 →
Power Conversion Circuit with Indicator Coupled to Input Terminal to Signal Condition of the Controller
Power Optimization System and Method for Low Power Devices
Long-Lasting Wettable Flanks
Application:
15/278,203 →
Publication:
US 2018/0090421
Hybrid Control Technique for Power Converters
Damaging Components with Defective Electrical Couplings
Imaging Systems with High Dynamic Range and Phase Detection Pixels
Programmable Amplifier and Method of Operating the Same
Semiconductor Package and Related Methods
Methods and Apparatus for a Polarizing Image Sensor
Methods and Apparatus for on-Chip Polarizer
Application:
62/324,224 →
Imaging Systems with High Dynamic Range and Phase Detection Pixels
Imaging Systems with Global Shutter Phase Detection Pixels
Application:
15/159,500 →
Publication:
US 2017/0339355
Output Driver Having Pull-Down Capability
Semiconductor Backmetal (Bm) and Over Pad Metallization (Opm) Structures and Related Methods
Patent:
9,640,497 →
Application:
15/198,859 →
Imaging Systems with High Dynamic Range and Phase Detection Pixels
Power Converter and Method of Entering Skip at a Fixed Output Power in a Light Load Condition Independent of Magnetizing Inductance
Active Clamp Power Converter and Method of Reducing Shoot-Through Current During Soft Start
Identifying Voltage to Prevent Motor Integrated Circuit Damage
Controlling Multiple Facets of Duty Cycle Response Using a Single Motor Integrated Circuit Pin
Controlling Lead Angle Using a Single Motor Integrated Circuit Pin
Semiconductor Device and Method of Integrating Power Module with Interposer and Opposing Substrates
Systems and Methods for Image Stabilization
Application:
62/324,523 →
Motor Driving Method
Application:
62/351,679 →
Methods and Apparatus for a Ccd Image Sensor
Embedded Directional Couplers and Related Methods
Image Sensors with Stacked Photodiodes
Methods and Apparatus for a Thermal Equalizer in an Image Sensor
Methods and Apparatus for an Analog-to-Digital Converter
Patent:
9,628,101 →
Application:
15/276,943 →
Image Sensors with Power Supply Noise Rejection Capabilities
Image Sensor System with an Automatic Focus Function
Application:
15/191,319 →
Publication:
US 2017/0374306
Low Power Sensor Communication Using Two or Fewer Wires
Semiconductor Device and Method of Forming Curved Image Sensor Region Robust Against Buckling
Image Sensors with Infrared-Blocking Layers
Quasi-Resonant Valley Lockout Without Feedback Reference
Apparatus and Methods for Buried Channel Transfer Gate
Application:
62/349,545 →
Auto Addressing Method Using Functional Connection
Application:
62/348,323 →
Semiconductor Die Singulation Methods
Electronic Die Singulation Method and Structure
Application:
62/344,725 →
Semiconductor Wafer and Method of Ball Drop on Thin Wafer with Edge Support Ring
Semiconductor Wafer and Method of Reducing Wafer Thickness with Asymmetric Edge Support Ring Encompassing Wafer Scribe Mark
Semiconductor Wafer and Method of Backside Probe Testing Through Opening in Film Frame
Patent:
9,793,186 →
Application:
15/230,875 →
Semiconductor Wafer and Method of Wafer Thinning Using Grinding Phase and Separation Phase
Analog-To-Digital Converter Circuitry with Offset Distribution Capabilities
Monolithically Integrated Power Switches and Control Logic
Application:
62/363,449 →
Vertical One-Time Programmable Fuse
Application:
62/365,677 →
Multi-Function Frequency Generation Pin
Application:
62/368,949 →
Image Sensors Having Dark Pixels
Dual channel LFM (Linear Frequency Modulation) chirp system
Application:
62/366,790 →
Capacitance Liquid Level Sensor
Application:
62/378,593 →
Rfid Antenna, Tag, and Method for Forming
Application:
62/383,226 →
Methods for Forming Backside Illuminated Image Sensors with Front Side Metal Redistribution Layers
Image Sensor Pixels with Light Guides and Light Shield Structures
Image Sensor with Heating Effect and Related Methods
Methods and Apparatus for an Images Sensor with Row-Level Gain Control
Hybrid Bonded Image Sensor and Method of Operating Such Image Sensor
Image Sensors with Phase Detection Pixels
Image Breathing Correction Systems and Related Methods
Image Sensors with Improved Surface Planarity
Image Sensors Having Photodiode Regions Implanted from Multiple Sides of a Substrate
Multi-Port Image Pixels
Fast Scr Structure for Esd Protection
Low-Voltage, High-Current Charging with Kelvin Sense from Travel Adaptor to Cell
Application:
62/402,759 →
Methods and Apparatus Related to Termination Regions of a Semiconductor Device
Application:
15/274,926 →
Publication:
US 2017/0012099
Silicon-Carbide Trench Gate Mosfets
Balancer for Multiple Field Effect Transistors Arranged in a Parallel Configuration
Application:
62/397,567 →
Reduction of Electrical Size of Bulk Capacitors in Mobile Power Supplies
Application:
62/400,386 →
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 19, 2016
From: BECK, RILEY D.; LAYTON, KENT D.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038321/0480 →
Assignment of Assignor's Interest
Apr 26, 2016
From: BECK, RILEY D.; TYLER, MATTHEW A.; LAYTON, KENT D.; GRANGE, SCOTT R.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038383/0866 →
Assignment of Assignor's Interest
Apr 26, 2016
From: YAO, THIERRY COFFI HERVE; SCOTT, GREGORY JAMES
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038387/0954 →
Assignment of Assignor's Interest
Apr 28, 2016
From: WARNECK, TIMOTHY J.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038411/0587 →
Assignment of Assignor's Interest
Jun 8, 2016
From: GRIVNA, GORDON M.; SALIH, ALI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038843/0866 →
Assignment of Assignor's Interest
Jun 17, 2016
From: GRIVNA, GORDON M.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038939/0663 →
Assignment of Assignor's Interest
Jul 6, 2016
From: LOECHELT, GARY
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 039083/0650 →
Assignment of Assignor's Interest
Jul 6, 2016
From: TRUHITTE, DARRELL D.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 039089/0807 →
Assignment of Assignor's Interest
Jul 7, 2016
From: ST. GERMAIN, STEPHEN; ARBUTHNOT, ROGER M.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 039099/0932 →
Assignment of Assignor's Interest
Jul 21, 2016
From: VENKATRAMAN, PRASAD; PADMANABHAN, BALAJI; SALIH, ALI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 039214/0154 →
Assignment of Assignor's Interest
Aug 1, 2016
From: GRIVNA, GORDON M.; SEDDON, MICHAEL J.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 039304/0686 →
Assignment of Assignor's Interest
Aug 5, 2016
From: SHARMA, UMESH; LIU, RONG; CHEN, YUPENG; HOLLAND, PHILLIP
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 039353/0812 →
Assignment of Assignor's Interest
Aug 26, 2016
From: GRIVNA, GORDON M.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 039554/0658 →
Assignment of Assignor's Interest
Sep 7, 2016
From: GEURTS, TOMAS; COOLS, THOMAS
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 039657/0254 →
Assignment of Assignor's Interest
Sep 9, 2016
From: PADMANABHAN, BALAJI; VENKATRAMAN, PRASAD; GRIVNA, GORDON M.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 039690/0925 →
Assignment of Assignor's Interest
Sep 16, 2016
From: BURGHOUT, WILLIAM F.; CONNER, DENNIS LEE; YODER, JAY A.; SEDDON, MICHAEL J.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 039764/0785 →
Assignment of Assignor's Interest
Sep 19, 2016
From: DE COCK, BART
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 039783/0533 →
Assignment of Assignor's Interest
Sep 26, 2016
From: TURCHI, JOEL
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 039856/0447 →
Assignment of Assignor's Interest
Mar 20, 2017
From: LIU, CHUN-LI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 041646/0727 →
Release of Security Interest in Patents Recorded at Reel 041187, Frame 0295
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064151/0203 →