IP Library Granted Patent US 10,192,922
Granted Patent B2
US 10,192,922 · App. 15/175,957 · Granted Jan 29, 2019

Charge packet signal processing using pinned photodiode devices

Inventor: Roger Panicacci (Los Angeles, CA)
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
H01L27/14643G01J1/4228H01L27/14609H03M1/1245G01J2001/446H03M1/468H03M1/56H03M3/438H03M3/456
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Quick Facts
Patent No.
US 10,192,922
App. No.
15/175,957
Granted
Jan 29, 2019
Kind
B2
Abstract

An image sensor may include an array of image pixels coupled to analog-to-digital conversion circuitry formed from pinned photodiode charge transfer circuits. Majority charge carriers for the pinned photodiodes in the charge transfer circuits may be electrons for photodiode wells formed from n-type doped regions and may be holes for photodiode formed from p-type doped regions. Pinned photodiodes may be used for charge integration onto a capacitive circuit node. Pinned photodiodes may also be used for charge subtraction from a capacitive circuit node. Comparator circuitry may be used to determine digital values for the pixel output levels in accordance with single-slope conversion, successive-approximation-register conversion, cyclic conversion, and first or second order delta-sigma conversion techniques. The array of image pixels used for imaging may have a conversion mode wherein at least a portion of the pixel circuitry in the array are operated similar to the charge transfer circuits.

Claims (28)

1. An image sensor, comprising:

an image pixel comprising a first pinned photodiode coupled to a pixel output line; and

analog-to-digital conversion (ADC) circuitry coupled to the pixel output line, wherein the ADC circuitry comprises:

a second pinned photodiode;

a comparator with first and second inputs;

a sampling transistor;

a first capacitive node that is coupled between the second pinned photodiode the first input of the comparator; and

a second capacitive node that is coupled between the sampling transistor and the second input of the comparator.

2. The image sensor defined in claim 1 , further comprising:

a first capacitor coupled between the first capacitive node and the first input of the comparator;

a first switch coupling the first capacitor to a first voltage supply;

a second capacitor coupled between the second capacitive node and the second input of the comparator; and

a second switch coupling the second capacitor to a second voltage supply.

3. The image sensor defined in claim 1 , further comprising:

a level shifter coupled between the pixel output line and the sampling transistor.

4. The image sensor defined in claim 1 , wherein the comparator has an output terminal, the image sensor further comprising:

a counter with an enable port that is coupled to the comparator output terminal.

5. The image sensor defined in claim 1 , further comprising:

a third pinned photodiode coupled to the second capacitive node.

6. The image sensor defined in claim 1 , further comprising:

a third pinned photodiode coupled to the first capacitive node;

a first transfer transistor coupled between the second pinned photodiode and the first capacitive node; and

a second transfer transistor coupled between the third pinned photodiode and the first capacitive node.

7. The image sensor defined in claim 6 , wherein a gate terminal of the first transfer transistor is coupled to a gate terminal of the second transfer transistor.

8. The image sensor defined in claim 6 , further comprising:

a voltage supply terminal;

a first fill transistor coupled between the voltage supply terminal and the second pinned photodiode; and

a second fill transistor coupled between the voltage supply terminal and the third pinned photodiode.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 041187, FRAME 0295 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064151/0203 →
SECURITY INTEREST Recorded Dec 23, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 041187/0295 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 7, 2016
From: PANICACCI, ROGER
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038836/0836 →
Continuity (1)
Related Publication 20170352696A1 · Dec 7, 2017