Electronic device including a conductive structure surrounded by an insulating structure
An electronic device can include a substrate and an insulating structure laterally surrounded by the substrate. In an aspect, the electronic device can include a first conductive structure or an active region that is laterally surrounded by the insulating structure and the substrate. In another aspect, the electronic device can include an inductor surrounded by the insulating structure. In a further aspect, a process of forming an electronic device can include patterning a substrate to define a trench and a plurality of features, including a first feature and a second feature, within the trench; forming a first insulating layer within the trench; removing the first feature to create a first cavity; forming a second insulating layer to at least partly fill the first cavity; removing the second feature to create a second cavity; and forming a conductive or semiconductor structure within the second cavity.
1. An electronic device comprising:
a substrate;
an insulating structure that is laterally surrounded by the substrate; and
a first conductive structure or an active region that is laterally surrounded by the insulating structure and the substrate, wherein:
the first conductive structure or active region is laterally spaced apart from the substrate by at least 4 microns, and
a plurality of insulating pillars is embedded within the first conductive structure.
2. The electronic device of claim 1 , further comprising a second conductive structure, wherein the electronic device includes the first conductive structure that is laterally surrounded by the second conductive structure.
3. The electronic device of claim 2 , wherein each of the first and second conductive structures is principally (1) an elemental metal or a metal alloy or (2) a semiconductor material, and the first and second conductive structures have different principal compositions.
4. The electronic device of claim 1 , wherein the electronic device includes the active region that includes a semiconductor material.
5. The electronic device of claim 4 , further comprising an electronic component within the active region.
6. The electronic device of claim 4 , wherein the substrate includes the semiconductor material.
7. The electronic device of claim 1 , wherein the first conductive structure is part of an n-axial conductor.
8. The electronic device of claim 7 , wherein the n-axial conductor further comprises second conductive structures.
9. The electronic device of claim 8 , wherein the second conductive structures are part of an outer ring that is surrounded by the insulating structure.
10. The electronic device of claim 9 , wherein the n-axial connector is a coaxial connector.
11. An electronic device comprising:
a substrate;
an insulating structure that includes an embedded void, wherein the insulating structure is within the substrate; and
an inductor laterally surrounded by the insulating structure and having a core that includes an insulating material or a magnetic material and does not include any portion of a semiconductor substrate, wherein the core is within the substrate.
12. The electronic device of claim 11 , wherein the inductor is a solenoid.
13. The electronic device of claim 12 , wherein the inductor includes a first interconnect and a second interconnect that are parts of a coil, the first interconnect lies along a first side of a die, and the second interconnect lies along a second side of the die that is opposite the first side.
14. The electronic device of claim 11 , wherein the inductor is a planar spiral inductor.
15. The electronic device of claim 11 , wherein the inductor further comprises conductive structures laterally surrounded by the insulating structure, wherein:
first side interconnects, including the first interconnect, contact the conductive structures along the first side, and
second side interconnects, including the second interconnect, contact the conductive structures along the second side.
16. The electronic device of claim 15 , wherein the core only includes one or more insulating materials and one or more voids.
17. The electronic device of claim 15 , wherein the core only includes one or more insulating materials.
18. The electronic device of claim 15 , wherein the core includes a magnetic material.
19. The electronic device of claim 18 , wherein the magnetic material is in a form of structures laterally surrounded by the insulating structure.
20. The electronic device of claim 19 , wherein:
the inductor further comprises first side interconnects along a first side of a die, and second side interconnect along a second side of the die that is opposite the first side;
the first side interconnects and the second side interconnects are not electrically connected to the structures that include the magnetic material.