Semiconductor device and method of forming cantilevered protrusion on a semiconductor die
A semiconductor device has a first semiconductor die with a base material. A covering layer is formed over a surface of the base material. The covering layer can be made of an insulating material or metal. A trench is formed in the surface of the base material. The covering layer extends into the trench to provide the cantilevered protrusion of the covering layer. A portion of the base material is removed by plasma etching to form a cantilevered protrusion extending beyond an edge of the base material. The cantilevered protrusion can be formed by removing the base material to the covering layer, or the cantilevered protrusion can be formed within the base material under the covering layer. A second semiconductor die is disposed partially under the cantilevered protrusion. An interconnect structure is formed between the cantilevered protrusion and second semiconductor die.
1. A method of making a semiconductor device, comprising:
providing a substrate;
providing a first semiconductor die including a base material;
forming a covering layer over a surface of the base material;
removing a portion of the base material to form a cantilevered protrusion of the covering layer extending beyond an edge of the base material; and
disposing the first semiconductor die over the substrate, wherein the cantilevered protrusion of the covering layer blocks material migrating from the substrate to the surface of the base material.
2. The method of claim 1 , wherein the covering layer is made of an insulating material or metal.
3. The method of claim 1 , further including:
forming a trench in the surface of the base material; and
forming the covering layer into the trench to provide the cantilevered protrusion of the covering layer.
4. The method of claim 1 , further including utilizing plasma etching to remove the portion of the base material.
5. The method of claim 1 , further including:
disposing a second semiconductor die partially under the cantilevered protrusion; and
forming an interconnect structure between the cantilevered protrusion and second semiconductor die.
6. A method of making a semiconductor device, comprising:
providing a first semiconductor die including a semiconductor material;
forming a trench in the surface of the semiconductor material;
forming a covering layer over a surface of the semiconductor material; and
removing a portion of the semiconductor material to form a cantilevered protrusion of the first semiconductor die, wherein forming the covering layer into the trench provides the cantilevered protrusion of the covering layer.
7. The method of claim 6 , wherein the covering layer is made of an insulating material or metal.
8. The method of claim 6 , wherein the cantilevered protrusion extends beyond an edge of the semiconductor material.
9. The method of claim 6 , further including utilizing plasma etching to remove the portion of the semiconductor material.
10. The method of claim 6 , further including forming the cantilevered protrusion within the semiconductor material.
11. The method of claim 6 , further including disposing a second semiconductor die partially under the cantilevered protrusion.
12. A semiconductor device, comprising:
a first semiconductor die including a semiconductor material;
a trench formed in the surface of the semiconductor material; and
a covering layer formed over a surface of the semiconductor material, wherein the first semiconductor die includes a cantilevered protrusion on a side surface of the semiconductor material, wherein the covering layer extends into the trench to provide the cantilevered protrusion of the covering layer.
13. The semiconductor device of claim 12 , wherein the covering layer is made of an insulating material or metal.
14. The semiconductor device of claim 12 , wherein the cantilevered protrusion is formed within the semiconductor material.
15. The semiconductor device of claim 12 , wherein the cantilevered protrusion extends beyond an edge of the semiconductor material.
16. The semiconductor device of claim 12 , further including a second semiconductor die disposed partially under the cantilevered protrusion.
17. The semiconductor device of claim 12 , further including a substrate, wherein the first semiconductor die is disposed over the substrate and the cantilevered protrusion blocks material migrating from the substrate to the surface of the semiconductor material.