Methods and apparatus for improved bonding
Various embodiments of the present technology may comprise a method and apparatus for improved bonding and may operate in conjunction with a main platform configured to support a substrate. Movable members may allow the substrate to be positioned on the main platform when rotated to a first position and apply a force to a predetermined area on an upward facing surface of the substrate when rotated to the second position.
1. An apparatus for securing a substrate, comprising:
a main platform configured to support the substrate;
a plurality of movable members positioned above the main platform and rotatable between a first position and a second position, wherein each movable member:
allows the substrate to be positioned on the main platform when rotated to the first position; and
applies a force to a predetermined area on an upward facing surface of the substrate when rotated to the second position;
wherein a first movable member of the plurality of movable members has a first length and a second movable member of the plurality of movable members has a second length longer than the first length; and
wherein each movable member is coupled to a spring-biased hinge.
2. The apparatus of claim 1 , wherein the main platform comprises:
a plurality of openings disposed along the main platform; and
a vacuum source in communication with the openings.
3. The apparatus of claim 2 , wherein the openings are arranged in a row pattern.
4. The apparatus of claim 1 , wherein at least two of the plurality of movable members are positioned substantially off-center from one another.
5. An apparatus for reducing warpage in a substrate, comprising:
a stage configured to support the substrate and comprising a plurality of openings;
a vacuum source configured to allow a vacuum pressure to be applied to a downward facing surface of the substrate via the plurality of openings;
a first shaft running parallel to a first side of the stage;
a first rotating member positioned above the stage, pivotably coupled to the first shaft, and rotatable between a first position and a second position; wherein the first rotating member has a first length;
a second shaft running parallel to a second side of the stage;
a second rotating member positioned above the stage, pivotably coupled to the second shaft, and rotatable between the first position and the second position; wherein the second rotating member has a second length longer than the first length;
a third rotating member having the first length and pivotably coupled to the first shaft; and
a fourth rotating member having the second length and pivotably coupled to the first shaft;
wherein the first rotating member applies a first spring force to a first upward facing surface area of the substrate at a first predetermined time, and the second rotating member applies a second spring force to a second upward facing surface area of the substrate at a second predetermined time.
6. The apparatus of claim 1 , further comprising:
a first shaft positioned adjacent to a first side of the main platform;
a second shaft positioned adjacent to a second side of the main platform, wherein the second side is opposite from the first side.
7. The apparatus of claim 6 , wherein a first end of each movable member is pivotably coupled to one of the first and second shafts.
8. The apparatus of claim 7 , wherein:
the first movable member is coupled to the first shaft; and
the second movable member is coupled to the second shaft.
9. The apparatus of claim 1 , wherein:
each movable member comprises:
a first end coupled to a shaft; and
a second end, opposite from the first end, comprising a contact portion.
10. The apparatus of claim 9 , wherein the second end of at least one movable member terminates at a center portion of the main platform.
11. The apparatus of claim 5 , wherein the second rotating member terminates at a center portion of the stage.